Room temperature bonding for vacuum applications: climatic and long time tests

Abstract

A detailed and quantitative motivation for the necessity of room temperature (RT) bonding for wafer level packaging of silicon micro-mirrors will be given. Results on RT 6 inch wafer bonding with vacuum encapsulation on test structures are presented. Structured as well as unstructured wafers have been bonded at RT using a Mitsubishi Heavy Industries bonder. Unstructured wafers were used for the determination of the bonding strength, whereas the structured wafers were used for the evaluation of vacuum level and its stability with time.