Room temperature bonding for vacuum applications: climatic and long time tests

LANGA, S.; UTSUMI, J.; LUDEWIG, T.; DRABE, C.

dc.contributor.author	LANGA, S.
dc.contributor.author	UTSUMI, J.
dc.contributor.author	LUDEWIG, T.
dc.contributor.author	DRABE, C.
dc.date.accessioned	2020-11-25T12:05:01Z
dc.date.available	2020-11-25T12:05:01Z
dc.date.issued	2013
dc.identifier.citation	LANGA, S., UTSUMI, J., LUDEWIG, T.et al. Room temperature bonding for vacuum applications: climatic and long time tests. In: Microsystem Technologies. 2013, V. 19, Iss. 5, pp. 681-687. ISSN 1432-1858.	en_US
dc.identifier.uri	https://doi.org/10.1007/s00542-012-1703-x
dc.identifier.uri	http://repository.utm.md/handle/5014/11748
dc.description	Access full text - https://doi.org/10.1007/s00542-012-1703-x	en_US
dc.description.abstract	A detailed and quantitative motivation for the necessity of room temperature (RT) bonding for wafer level packaging of silicon micro-mirrors will be given. Results on RT 6 inch wafer bonding with vacuum encapsulation on test structures are presented. Structured as well as unstructured wafers have been bonded at RT using a Mitsubishi Heavy Industries bonder. Unstructured wafers were used for the determination of the bonding strength, whereas the structured wafers were used for the evaluation of vacuum level and its stability with time.	en_US
dc.language.iso	en	en_US
dc.publisher	Springer Nature Switzerland	en_US
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 United States	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.subject	micro-mirrors	en_US
dc.subject	wafer levels	en_US
dc.subject	bonding	en_US
dc.subject	wafers	en_US
dc.title	Room temperature bonding for vacuum applications: climatic and long time tests	en_US
dc.type	Article	en_US