IRTUM – Institutional Repository of the Technical University of Moldova

Browsing Articole din publicaţii internaţionale by Subject "wafers"

Browsing Articole din publicaţii internaţionale by Subject "wafers"

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  • Enhancement of vertical integration density by engineered BSOI wafers 
    KADEN, C.; LANGA, S.; LUDEWIG, T.; SCHÖNBERGER, A.; HERRMANN, A.; GÖBEL, A.; KOLKOVSKY, V.; JEROCH, W.; PUFE, W. (Springer Nature Switzerland, 2018)
    The lateral and vertical integration density of bulk microelectromechanical systems (MEMS) using bonded silicon-on-insulator (BSOI) wafers is significantly enhanced if the handle wafer is used as an electrical redistribution ...
  • Modulation of Electrical Conductivity and Lattice Distortions in Bulk HVPE-Grown GaN 
    WOLFF, Niklas; JORDT, Philipp; BRANISTE, Tudor; POPA, Veaceslav; MONAICO, Eduard; URSAKI, Veaceslav; PETRARU, Adrian; ADELUNG, Rainer; MURPHY, Bridget M.; KIENLE, Lorenz; TIGINYANU, Ion (The Electrochemical Society, 2019)
    The nature of self-organized three-dimensional structured architectures with spatially modulated electrical conductivity emerging in the process of hydride vapor phase epitaxial growth of single crystalline n-GaN wafers ...
  • Room temperature bonding for vacuum applications: climatic and long time tests 
    LANGA, S.; UTSUMI, J.; LUDEWIG, T.; DRABE, C. (Springer Nature Switzerland, 2013)
    A detailed and quantitative motivation for the necessity of room temperature (RT) bonding for wafer level packaging of silicon micro-mirrors will be given. Results on RT 6 inch wafer bonding with vacuum encapsulation on ...

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