KADEN, C.; LANGA, S.; LUDEWIG, T.; SCHÖNBERGER, A.; HERRMANN, A.; GÖBEL, A.; KOLKOVSKY, V.; JEROCH, W.; PUFE, W.
(Springer Nature Switzerland, 2018)
The lateral and vertical integration density of bulk microelectromechanical systems (MEMS) using bonded silicon-on-insulator (BSOI) wafers is significantly enhanced if the handle wafer is used as an electrical redistribution ...