Process Control and Failure Analysis Implementation for THz Schottky-based components

Abstract

Schottky diodes and integrated circuits are most used devices for both frequency mixing and multiplying in THz range. Higher operational frequencies require of the devise dimensions. Devise dimensions in THz range are often comparable and are even below one micron, which increases the importance of reliability issues of Schottky diodes. Due to the enhanced sophisticated fabrication process, especially in the case of planar devices and integrated circuits, many failure mechanisms of high-frequency semiconductor devices can be directly traced to the failures in the fabrication process.