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Influence of preparation parameters for low-energy ion beam nitridation of III–V semiconductor surfaces

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dc.contributor.author HECHT, J.-D.
dc.contributor.author FROST, F.
dc.contributor.author SIDORENKO, A.
dc.contributor.author HIRSCH, D.
dc.contributor.author NEUMANN, H.
dc.contributor.author SCHINDLER, A.
dc.contributor.author KRASNIKOW, S.
dc.contributor.author ZHANG, L.
dc.contributor.author CHASSÉ, T.
dc.date.accessioned 2020-12-07T09:50:04Z
dc.date.available 2020-12-07T09:50:04Z
dc.date.issued 2003
dc.identifier.citation HECHT, J.-D., FROST, F., SIDORENKO, A. et al. Influence of preparation parameters for low-energy ion beam nitridation of III–V semiconductor surfaces. In: Solid-State Electronics. 2003, V. 47, Iss. 3, pp. 413-418. ISSN 0038-1101. en_US
dc.identifier.uri https://doi.org/10.1016/S0038-1101(02)00381-7
dc.identifier.uri http://repository.utm.md/handle/5014/11918
dc.description Access full text - https://doi.org/10.1016/S0038-1101(02)00381-7 en_US
dc.description.abstract The nitridation of InAs, InP, and InSb by low-energy N2+ ion bombardment at different preparation parameters was studied by near-edge X-ray absorption fine structure, photoemission spectroscopy (PES), and resonant PES measurements. The investigated surface nitride layers mainly consist of compounds with In–N, V–N bonds and interstitial nitrogen (Ni). The final remaining nitride layer composition strongly depends on the chosen preparation parameters. The nitridation affect composition and annealing temperature offers several opportunities to affect defect curing by ordering and removing oxinitrides, N–O bonds and Ni from nitrided surfaces. en_US
dc.language.iso en en_US
dc.publisher Elservier en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject photoemission spectroscopy en_US
dc.subject spectroscopy en_US
dc.subject ion bombardment en_US
dc.subject oxinitrides en_US
dc.subject defects en_US
dc.title Influence of preparation parameters for low-energy ion beam nitridation of III–V semiconductor surfaces en_US
dc.type Article en_US


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