Hardness of Cu/LiF composite structure under dynamical indentation

Abstract

A permanent growth of the integration level and packaging density of chips on the crystals requires the sufficient increase of reliability and enhancement of the material servicing characteristics. At present, as a rule, aluminium and Al-Cu alloys are used as basic material for the interconnections. As a potential substitute for Al, it can be considered copper, which possesses higher properties: thermal capacity, thermal conductivity, electroconductivity and considerable resistance to the electromigration. It is known, servicing characteristics of thin metallic films are generally determined by electrical properties. At the same time, mechanical properties determine the service life period of product, therefore it is necessary to make the durable and reliable goods.