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Influence of loading holding time under quasistatic indentation on electrical properties and phase transformations of silicon

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dc.contributor.author SHIKIMAKA, O.
dc.contributor.author PRISACARU, A.
dc.contributor.author BRUK, L.
dc.contributor.author USATYI, Yu.
dc.contributor.author BURLACU, A.
dc.date.accessioned 2021-05-17T11:00:16Z
dc.date.available 2021-05-17T11:00:16Z
dc.date.issued 2012
dc.identifier.citation SHIKIMAKA, O., PRISACARU, A., BRUK, L., USATYI, Yu et al. Influence of loading holding time under quasistatic indentation on electrical properties and phase transformations of silicon. In: Surface Engineering and Applied Electrochemistry. 2012, V. 48, Iss. 5, pp. 444-449. ISSN 1934-8002. en_US
dc.identifier.uri https://doi.org/10.3103/S1068375512050122
dc.identifier.uri http://repository.utm.md/handle/5014/14955
dc.description Access full text - https://doi.org/10.3103/S1068375512050122 en_US
dc.language.iso en en_US
dc.publisher Springer Nature Switzerland en_US
dc.rights The quasistatic Vickers indentation of Si (100) were applied to investigate the influence of loading holding time on the changes of electrical resistance and phase transformation in the indentation zone. For all used loading regimes with different holding times (2 s, 10 s, 1 h and 10 h) in combination with constant loading-unloading rate (250 mN/s) the electrical resistance in the region of residual indentations was found to be lower than before indentation. It was shown that this is connected with the formation of semimetallic Si-III phase and amorphous Si of higher pressure induced by creep process developed under long lasting pressure. The longer the holding time, the greater lowering of electrical resistance in the indentation region was observed, with the exception of the holding time above 1 h, this being explained by a decelerating creep rate of Si for this interval of time leading to a halt of further extending of amorphous and Si-III regions of lower electrical resistance. en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject silicon en_US
dc.title Influence of loading holding time under quasistatic indentation on electrical properties and phase transformations of silicon en_US
dc.type Article en_US


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The quasistatic Vickers indentation of Si (100) were applied to investigate the influence of loading holding time on the changes of electrical resistance and phase transformation in the indentation zone. For all used loading regimes with different holding times (2 s, 10 s, 1 h and 10 h) in combination with constant loading-unloading rate (250 mN/s) the electrical resistance in the region of residual indentations was found to be lower than before indentation. It was shown that this is connected with the formation of semimetallic Si-III phase and amorphous Si of higher pressure induced by creep process developed under long lasting pressure. The longer the holding time, the greater lowering of electrical resistance in the indentation region was observed, with the exception of the holding time above 1 h, this being explained by a decelerating creep rate of Si for this interval of time leading to a halt of further extending of amorphous and Si-III regions of lower electrical resistance. Except where otherwise noted, this item's license is described as The quasistatic Vickers indentation of Si (100) were applied to investigate the influence of loading holding time on the changes of electrical resistance and phase transformation in the indentation zone. For all used loading regimes with different holding times (2 s, 10 s, 1 h and 10 h) in combination with constant loading-unloading rate (250 mN/s) the electrical resistance in the region of residual indentations was found to be lower than before indentation. It was shown that this is connected with the formation of semimetallic Si-III phase and amorphous Si of higher pressure induced by creep process developed under long lasting pressure. The longer the holding time, the greater lowering of electrical resistance in the indentation region was observed, with the exception of the holding time above 1 h, this being explained by a decelerating creep rate of Si for this interval of time leading to a halt of further extending of amorphous and Si-III regions of lower electrical resistance.

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