Degradarea termodinamică (Thermodynamic Degradation)

BĂJENESCU, Titu-Marius I.

dc.contributor.author	BĂJENESCU, Titu-Marius I.
dc.date.accessioned	2020-12-15T15:13:09Z
dc.date.available	2020-12-15T15:13:09Z
dc.date.issued	2017
dc.identifier.citation	BĂJENESCU, Titu-Marius I. “Degradarea termodinamică” (Thermodynamic Degradation). In: Electrotehnica, Electronica, Automatica (EEA), 2017, vol. 65, no. 4, pp. 96-100, ISSN 1582-5175.	en_US
dc.identifier.uri	http://repository.utm.md/handle/5014/12119
dc.description	Sursa: http://www.eea-journal.ro/ro/d/5/p/EEA65_4_15	en_US
dc.description.abstract	Smaller, lighter, faster, cheaper are today demands in microelectronics; new technologies stack and interconnect materials and components are utilised to achieve high density, small size, low weight, reduced power, and very low cost. Particularly important in this context is the thermodynamic degradation that offers new tools, new ways to solve PoF problems and prevent failure. Prognostics using a thermodynamic energy approach should advance our capabilities.	en_US
dc.language.iso	ro	en_US
dc.publisher	Electra Publishing House	en_US
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 United States	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.subject	microelectronic interconnetions	en_US
dc.subject	reliability limitations	en_US
dc.subject	diffusion barrier	en_US
dc.title	Degradarea termodinamică (Thermodynamic Degradation)	en_US
dc.type	Article	en_US