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Surface-charge lithography for GaN microstructuring based on photoelectrochemical etching techniques

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dc.contributor.author TIGINYANU, I. M.
dc.contributor.author POPA, V.
dc.contributor.author VOLCIUC, O.
dc.date.accessioned 2020-10-08T10:38:05Z
dc.date.available 2020-10-08T10:38:05Z
dc.date.issued 2005
dc.identifier.citation TIGINYANU, I. M., POPA, V., VOLCIUC, O. Surface-charge lithography for GaN microstructuring based on photoelectrochemical etching techniques. In: Applied Physics Letters. 2005, V. 86, Iss. 17, pp. 174102-1-174102-3. ISSN 0003-6951. en_US
dc.identifier.uri https://doi.org/10.1063/1.1919393
dc.identifier.uri http://repository.utm.md/handle/5014/10568
dc.description Access full text - https://doi.org/10.1063/1.1919393 en_US
dc.description.abstract We show that host defects introduced at the surface of GaN epilayers by mechanical means se.g., using needles, microscribersd, or 2-keV-argon ion beam are resistant to photoelectrochemical etching in aqueous solution of KOH, presumably due to trapped negative charge. The spatial distribution of surface defects and related negative charge can be designed as lithographic mask for the purpose of GaN microstructuring. The possibility to fabricate GaN mesostructures using the approach involved is demonstrated. en_US
dc.language.iso en en_US
dc.publisher American Institute of Physics en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject epilayers en_US
dc.subject surface defects en_US
dc.subject lithographic masks en_US
dc.subject mesostructures en_US
dc.title Surface-charge lithography for GaN microstructuring based on photoelectrochemical etching techniques en_US
dc.type Article en_US


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