Кинетика металлизации и рассеивающая способность электролитов при получении нанокомпозитов на основе AIIIBV

Abstract

The investigation of kinetics of deposition in nanopores at fabrication of n-InP - oxide of metal nanocomposites has been carried out. The correlation of kinetics of chemical plating with uniformity of metallization of nanostructured surface obtained by electrochemical dissolution of n-InP has been established. The results of investigation demonstrate that enhancement of uniformity of obtained layers (increase of nano-throwing power of electrolyte for chemical metallization) at fabrication of AIIIBV - oxide of metal (copper, silver) is defined by rate of chemical process (which is determined by composition and concentration of solution, and its temperature). We showed that nano-throwing power increases at decreasing deposition rate. Analysis of obtained results shows that uniformity of pores filling is one of the main factors, which determine not only high extent of pores filling by deposited material, but also possibility itself (at high plating rate metal concentration in top layers of porous material is higher that results in closing pores and stopping their consequent filling).