Abstract:
The rapid growth of electronic devices, wireless communication systems, and high-frequency technologies has significantly increased electromagnetic radiation in modern environments, leading to serious electromagnetic interference (EMI) challenges. EMI can disrupt electronic systems, decrease device reliability, and weaken communication networks. As a result, developing efficient, lightweight, and sustainable EMI shielding materials has become a key research focus. While conventional metallic shields provide high electrical conductivity and strong reflection-based shielding, they also have disadvantages, including high density, corrosion susceptibility, and limited design flexibility.