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Silicon nitride ceramic substrates for chip substrate applications

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dc.contributor.author BALÁZSI, Csaba
dc.contributor.author BALÁZSI, Katalin
dc.date.accessioned 2026-10-13T06:06:00Z
dc.date.available 2026-10-13T06:06:00Z
dc.date.issued 2026
dc.identifier.citation BALÁZSI, Csaba and Katalin BALÁZSI. Silicon nitride ceramic substrates for chip substrate applications. In: 10th International Symposium on Dielectric Materials and Application, Abstract Book, ISyDMA’10, Chisinau, Republic of Moldova, 30 June -4 July, 2026. Technical University of Moldova. Chişinău: 2026, p. 30. en_US
dc.identifier.uri https://repository.utm.md/handle/5014/37320
dc.description.abstract The lecture will give a comprehensive view on innovative developments made in the field of nanocarbons e.g. carbon black, carbon nanotubes (CNTs), graphene added ceramics highlighting the key issues related to integration technology and improvements in the mechanical, tribological or functional properties as a result. Among non-oxide ceramics the silicon nitride based ceramics are well-known as lowdensity materials with high strength and toughness. Silicon nitride, known as a typical dielectric material, is an ideal candidate for several structural applications, even at high temperatures. The addition of graphene or carbon nanotubes to silicon nitride to create ceramic nanocomposites gives rise to promising applications in a wide range of fields such as electronics, biomedical aids, membranes, flexible wearable sensors and actuators, energy systems. It is wellknown that silicon nitride ceramic substrate has excellent insulation performance and good heat dissipation, therefore can be used to manufacture various high-power electrical components, such as power modules, heating modules, etc., effectively ensuring the service life and reliability of electrical equipment. The presentation will show how the use of different reinforcing phases, their dispersion grade, ceramic matrix – CNTs, graphene interphases and sintering methods influence the microstructure and as a result, mechanical properties, electrical, thermal conductivity and tribological properties of the final silicon nitride nanocomposites. The prospective future applications will be also discussed. en_US
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject silicon nitride en_US
dc.subject carbon nanotube en_US
dc.subject graphene en_US
dc.subject substrates en_US
dc.title Silicon nitride ceramic substrates for chip substrate applications en_US
dc.type Article en_US


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