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Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat

Show simple item record GANGAN, Silvia ROTARU, Mihail DIMITRACHE, Pavel POPESCU, Nicolae 2019-12-06T08:39:30Z 2019-12-06T08:39:30Z 2012
dc.identifier.citation GANGAN, Silvia, ROTARU, Mihail, DIMITRACHE, Pavel et al. Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat. In: Telecommunications, Electronics and Informatics- ICTEI 2012: proc. of the 5th intern. conf., Technical University of Moldova, May 11-13, 2012. Chișinău, 2012, Vol. 1, pp. 271-274. ISBN 978-9975-45-082-9. en_US
dc.identifier.isbn 978-9975-45-082-9
dc.description.abstract This article presents some peculiarities of assembly of BGA – components on the surface of multilayer printed circuit. Difficulties in the choice of ball terminals and controlling the soldering quality are described. An algorithm for the inspection of the quality by gradually measuring of electrical parameters is proposed. en_US
dc.language.iso ro en_US
dc.publisher Technical University of Moldova en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri *
dc.subject ball grid array components en_US
dc.subject BGA en_US
dc.subject carcase en_US
dc.subject circuite imprimate en_US
dc.subject roentgenograme en_US
dc.subject multistraturi en_US
dc.title Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat en_US
dc.type Article en_US

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