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Correlation of the CubeSat TestPod vibration test results with finite element analysis

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dc.contributor.author BOSTAN, Viorel
dc.contributor.author GUȚU, Marin
dc.contributor.author MELNIC, Vladimir
dc.contributor.author MARTÎNIUC, Alexei
dc.date.accessioned 2024-12-08T10:20:20Z
dc.date.available 2024-12-08T10:20:20Z
dc.date.issued 2024
dc.identifier.citation BOSTAN, Viorel; Marin GUȚU; Vladimir MELNIC and Alexei MARTÎNIUC. Correlation of the CubeSat TestPod vibration test results with finite element analysis. In: Electronics, Communications and Computing (IC ECCO-2024): The conference program and abstract book: 13th intern. conf., Chişinău, 17-18 Oct. 2024. Technical University of Moldova. Chişinău: Tehnica-UTM, 2024, pp. 171-172. ISBN 978-9975-64-480-8 (PDF). en_US
dc.identifier.isbn 978-9975-64-480-8
dc.identifier.uri http://repository.utm.md/handle/5014/28801
dc.description Only Abstract en_US
dc.description.abstract One of the important verification steps before the launch of the nanosatellite developed at TUM (TUMnanoSAT) was vibration testing of the real model. These tests were carried out according to the requirements submitted by the Japan Aerospace Exploration Agency (JAXA) in collaboration with which the launch of our nanosatellite was possible. Thus, in order to validate the structural integrity of CubeSat nanosatellites under launch loads, a 1U TestPod was designed and manufactured. en_US
dc.language.iso en en_US
dc.publisher Technical University of Moldova en_US
dc.relation.ispartofseries Electronics, Communications and Computing (IC ECCO-2024): 13th intern. conf., 17-18 Oct. 2024;
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject vibration test en_US
dc.subject modal analysis en_US
dc.subject numerical model en_US
dc.title Correlation of the CubeSat TestPod vibration test results with finite element analysis en_US
dc.type Article en_US


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  • 2024
    The 13th International Conference on Electronics, Communications and Computing (IC ECCO-2024)

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