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Relaxation Parameters of Cu/substrate Type Coated Systems Under Nanoindentation

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dc.contributor.author GRABCO, D.
dc.contributor.author PYRTSAC, C.
dc.contributor.author SHIKIMAKA, O.
dc.date.accessioned 2022-02-04T07:40:58Z
dc.date.available 2022-02-04T07:40:58Z
dc.date.issued 2022
dc.identifier.citation GRABCO, D., PYRTSAC, C., SHIKIMAKA, O. Relaxation Parameters of Cu/substrate Type Coated Systems Under Nanoindentation. In: 5th International Conference on Nanotechnologies and Biomedical Engineering, ICNBME: proc. IFMBE, 3-5 Nov. 2021, Chișinău, Moldova, 2022, V. 87, pp. 55-61. ISBN 978-3-030-92328-0. en_US
dc.identifier.isbn 978-3-030-92328-0
dc.identifier.uri https://doi.org/10.1007/978-3-030-92328-0_8
dc.identifier.uri http://repository.utm.md/handle/5014/19154
dc.description Acces full text - https://doi.org/10.1007/978-3-030-92328-0_8 en_US
dc.description.abstract In this work, we studied the relaxation parameters, he-p and hres, of three composite structures Cu/LiF, Cu/MgO, and Cu/Si, which have different types of a chemical bond between the substrates (ionic (LiF), ionic-covalent (MgO), and covalent (Si)) and differ in hardness (HCu = 0.6 GPa, HLiF, HMgO and HSi are 1.2, 7.5 and 8.2 GPa, respectively). For each type of substrates, coated systems (CSs) were fabricated with a following Cu film thickness: t1 = 85; t2 = 470 and t3 = 1000 nm. The behavior of relaxation parameters was examined over a wide range of loads, P = 2–900 mN, during nanoindentation. The elastic-plastic parameters were shown to depend on the CS type, as well as on the film thickness and the magnitude of the applied load. en_US
dc.language.iso en en_US
dc.publisher Springer, Cham en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject nanoindentation en_US
dc.subject relaxation parameters en_US
dc.subject composite structures en_US
dc.subject coated systems en_US
dc.subject nanoindentation en_US
dc.subject films en_US
dc.title Relaxation Parameters of Cu/substrate Type Coated Systems Under Nanoindentation en_US
dc.type Article en_US


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