Browsing by Subject "wafers"

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  • Controlling the Degree of Hydrophilicity/Hydrophobicity of Semiconductor Surfaces via Porosification and Metal Deposition 
    MONAICO, E. V.; BUSUIOC, S.; TIGINYANU, I. M. (Springer, Cham, 2022)
    In this paper we present a systematic study of bulk GaAs wafers and gold-decorated GaAs surfaces exhibiting hydrophilic and hydrophobic behaviors. The wetting properties can be switched to superhydrophilicity and ...
  • Enhancement of vertical integration density by engineered BSOI wafers 
    KADEN, C.; LANGA, S.; LUDEWIG, T.; SCHÖNBERGER, A.; HERRMANN, A.; GÖBEL, A.; KOLKOVSKY, V.; JEROCH, W.; PUFE, W. (Springer Nature Switzerland, 2018)
    The lateral and vertical integration density of bulk microelectromechanical systems (MEMS) using bonded silicon-on-insulator (BSOI) wafers is significantly enhanced if the handle wafer is used as an electrical redistribution ...
  • Modulation of Electrical Conductivity and Lattice Distortions in Bulk HVPE-Grown GaN 
    WOLFF, Niklas; JORDT, Philipp; BRANISTE, Tudor; POPA, Veaceslav; MONAICO, Eduard; URSAKI, Veaceslav; PETRARU, Adrian; ADELUNG, Rainer; MURPHY, Bridget M.; KIENLE, Lorenz; TIGINYANU, Ion (The Electrochemical Society, 2019)
    The nature of self-organized three-dimensional structured architectures with spatially modulated electrical conductivity emerging in the process of hydride vapor phase epitaxial growth of single crystalline n-GaN wafers ...
  • Room temperature bonding for vacuum applications: climatic and long time tests 
    LANGA, S.; UTSUMI, J.; LUDEWIG, T.; DRABE, C. (Springer Nature Switzerland, 2013)
    A detailed and quantitative motivation for the necessity of room temperature (RT) bonding for wafer level packaging of silicon micro-mirrors will be given. Results on RT 6 inch wafer bonding with vacuum encapsulation on ...
  • The use of spent grain in obtaining some flour products 
    CHETRARIU, Ancuța; DABIJA, Adriana (Universitatea Tehnică a Moldovei, 2022)
    The studies carried out were based on the use of spent grain in recipes for the manufacture of pasta, wafers and an assortment of ginger bread. The level of consumer acceptability was relatively high, averaging up to 15% ...

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