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Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat
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| dc.contributor.author | GANGAN, Silvia | |
| dc.contributor.author | ROTARU, Mihail | |
| dc.contributor.author | DIMITRACHE, Pavel | |
| dc.contributor.author | POPESCU, Nicolae | |
| dc.date.accessioned | 2019-12-06T08:39:30Z | |
| dc.date.available | 2019-12-06T08:39:30Z | |
| dc.date.issued | 2012 | |
| dc.identifier.citation | GANGAN, Silvia, ROTARU, Mihail, DIMITRACHE, Pavel et al. Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat. In: Telecommunications, Electronics and Informatics- ICTEI 2012: proc. of the 5th intern. conf., Technical University of Moldova, May 11-13, 2012. Chișinău, 2012, Vol. 1, pp. 271-274. ISBN 978-9975-45-082-9. | en_US |
| dc.identifier.isbn | 978-9975-45-082-9 | |
| dc.identifier.uri | http://repository.utm.md/handle/5014/7322 | |
| dc.description.abstract | This article presents some peculiarities of assembly of BGA – components on the surface of multilayer printed circuit. Difficulties in the choice of ball terminals and controlling the soldering quality are described. An algorithm for the inspection of the quality by gradually measuring of electrical parameters is proposed. | en_US |
| dc.language.iso | ro | en_US |
| dc.publisher | Technical University of Moldova | en_US |
| dc.rights | Attribution-NonCommercial-NoDerivs 3.0 United States | * |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/us/ | * |
| dc.subject | ball grid array components | en_US |
| dc.subject | BGA | en_US |
| dc.subject | carcase | en_US |
| dc.subject | circuite imprimate | en_US |
| dc.subject | roentgenograme | en_US |
| dc.subject | multistraturi | en_US |
| dc.title | Particularităţile asamblării BGA-componentelor pe circuite imprimate multistrat | en_US |
| dc.type | Article | en_US |
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