Relaxation parameters of Cu/substrate coated systems

Abstract

In recent years, special attention has been paid to the development and fabrication of new materials, in particular to the coated systems (CS). From a practical point of view, the relaxation processes under nanoindentation in the film/substrate CS are of a major interest and are studied in present paper. These parameters need to be considered in lithographic technologies that use printing (penetration of resist-marking with a nanometric scale model), recording and storing information by nanoindentation methods in nanomechanical systems.