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3D micropackaging of integrated circuits
BĂJENESCU, Titu-Marius I.
(
Tehnica UTM
,
2020
)
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Author
BĂJENESCU, Titu-Marius I. (1)
Subject
circuite integrate (1)
fiabilitate (1)
industria microelectronică (1)
legea Moore (1)
microelectronic industry (1)
Moore's Law (1)
prototipaj virtual (1)
prototypage virtuel (1)
reliability (1)
... View More
Date Issued
2020 (1)
Has File(s)
Yes (1)